Yadda Ake Zaɓan Ƙarshen Surface don Ƙirar PCB ɗinku
Ⅱ Kima da Kwatance
Akwai nasihu da yawa game da ƙarewar ƙasa, kamar HASL-free gubar yana da matsala don samun daidaiton kwanciyar hankali.Electrolytic Ni/Au yana da tsada sosai kuma idan aka ajiye zinari da yawa akan kushin, zai iya haifar da gaɓar haɗin gwiwa.nutsewa tin yana solderability lalacewa bayan daukan hotuna zuwa mahara zafi hawan keke, kamar yadda a cikin wani saman da kasa gefen PCBA reflow tsari, da dai sauransu .. A bambance-bambancen na sama surface gama bukatar zama a fili sane.Teburin da ke ƙasa yana nuna ƙayyadaddun ƙima don ƙayyadaddun allon da'irar da aka yi amfani da su akai-akai.
Table1 A taƙaice bayanin tsarin masana'antu, ribobi da fursunoni masu mahimmanci, da aikace-aikace na yau da kullun na mashahurin saman da ba su da gubar na PCB.
| PCB Surface Gama | Tsari | Kauri | Amfani | Rashin amfani | Aikace-aikace na yau da kullun |
| HASL mara gubar | Ana nutsar da allunan PCB a cikin narkakkar wankan kwano sannan a busa wukake na iska mai zafi don lebur da cire kayan da suka wuce gona da iri. | 30µin (1µm) -1500µin (40µm) | Kyakkyawan Solderability;Yadu samuwa;Ana iya gyarawa / sake yin aiki;Dogon shiryayye mai tsayi | Filaye marasa daidaituwa;Thermal girgiza;Rashin lalata;Solder gada;PTHs masu toshe. | Yadu aiki;Ya dace da manyan pads da tazara;Bai dace da HDI ba tare da <20 mil (0.5mm) farar kyau da BGA;Ba shi da kyau ga PTH;Bai dace da PCB mai kauri ba;Yawanci, aikace-aikace: allon kewayawa don gwajin lantarki, sayar da hannu, wasu manyan kayan lantarki kamar sararin samaniya da na'urorin soja. |
| OSP | Yin amfani da sinadari na kwayoyin halitta zuwa saman allunan da ke samar da wani nau'in karfe na kwayoyin halitta don kare fallasa jan karfe daga tsatsa. | 46µin (1.15µm) -52µin (1.3µm) | Maras tsada;Pads ne uniform da lebur;Kyakkyawan solderability;Za a iya zama naúrar tare da sauran ƙarewar saman;Tsari yana da sauƙi;Ana iya sake yin aiki (a cikin bitar). | Mai hankali ga kulawa;Short shelf rai.Iyakantaccen solder yadawa;Rushewar solderability tare da yanayin zafi & hawan keke;Mara aiki;Yana da wahala a bincika, ICT bincike, ionic & latsa-fit damuwa | Yadu aiki;Da kyau dace da SMT / filaye masu kyau / BGA / ƙananan abubuwan haɓaka;Bauta alluna;Ba kyau ga PTHs;Bai dace da fasahar crimping ba |
| ENIG | Wani tsari na sinadari wanda ke sanya tagulla da aka fallasa tare da nickel da Zinariya, don haka ya ƙunshi nau'i biyu na murfin ƙarfe. | 2µin (0.05µm) – 5µin (0.125µm) na Zinare akan 120µin (3µm) – 240µin (6µm) na nickel | Kyakkyawan solderability;Pads ne lebur da uniform;Al waya lanƙwasa;Ƙananan juriya na lamba;Rayuwa mai tsawo;Kyakkyawan juriya na lalata da karko | damuwa "Black Pad";Asarar sigina don aikace-aikacen amincin sigina;kasa sake yin aiki | Madalla don Tattaunawar farar mai kyau da kuma hadadden wuri mai tsayi (BGA, QFP…);Madalla don nau'ikan Siyar da yawa;Zai fi dacewa don PTH, latsa dacewa;Waya mai ɗaurewa;Shawarwari ga PCB tare da babban abin dogaro aikace-aikace kamar sararin samaniya, soja, likita da manyan masu amfani, da sauransu;Ba a ba da shawarar don Tabbataccen Tuntuɓi ba. |
| Electrolytic Ni/Au (Zinare mai laushi) | 99.99% tsarki - 24 carat Zinariya da aka yi amfani da shi a kan Layer nickel ta hanyar tsarin lantarki kafin soldermask. | 99.99% Zinariya mai tsafta, 24 Karat 30µin (0.8µm) -50µin (1.3µm) sama da 100µin (2.5µm) -200µin (5µm) na nickel | Hard, m surface;Babban haɓakawa;Lalata;Al waya lanƙwasa;Ƙananan juriya na lamba;Rayuwa mai tsawo | Mai tsada;Au embrittlement idan yayi kauri;Ƙuntataccen tsari;Ƙarin aiki / aiki mai tsanani;Ba dace da soldering;Tufafi ba uniform ba ne | Anfi amfani dashi a haɗin waya (Al & Au) a cikin kunshin guntu kamar COB (Chip on Board) |
| Electrolytic Ni/Au (Zinare mai ƙarfi) | 98% mai tsabta - 23 carat Zinariya tare da masu taurin da aka saka a cikin wankan plating da aka shafa akan Layer nickel ta hanyar tsarin lantarki. | 98% Zinare mai tsabta, 23 Karat30µin (0.8µm) -50µin (1.3µm) sama da 100µin (2.5µm) -150µin (4µm) na nickel | Kyakkyawan solderability;Pads ne lebur da uniform;Al waya lanƙwasa;Ƙananan juriya na lamba;Mai sake yin aiki | Tarnish (karɓawa & ajiya) lalata a cikin babban yanayin sulfur;Rage zaɓuɓɓukan sarkar samar da kayayyaki don tallafawa wannan ƙarewa;Shortan taga mai aiki tsakanin matakan taro. | Yafi amfani da wutar lantarki interconnection kamar gefen haši (yatsa na zinariya), IC m allon (PBGA/FCBGA/FCCSP...) , Keyboards, baturi lambobin sadarwa da kuma wasu gwajin pads, da dai sauransu. |
| Immersion Ag | Ana ajiye wani Layer na Azurfa akan saman jan karfe ta hanyar yin plating mara amfani bayan etch amma kafin soldermask | 5µin (0.12µm) -20µin (0.5µm) | Kyakkyawan solderability;Pads ne lebur da uniform;Al waya lanƙwasa;Ƙananan juriya na lamba;Mai sake yin aiki | Tarnish (karɓawa & ajiya) lalata a cikin babban yanayin sulfur;Rage zaɓuɓɓukan sarkar samar da kayayyaki don tallafawa wannan ƙarewa;Shortan taga mai aiki tsakanin matakan taro. | Madadin tattalin arziƙi zuwa ENIG don Fine Traces da BGA;Mafi dacewa don aikace-aikacen sigina na sauri;Yana da kyau don sauya membrane, garkuwar EMI, da haɗin waya na aluminum;Dace da dacewa da latsa. |
| Immersion Sn | A cikin wankan sinadari maras amfani da lantarki, farar siraren siriri na Tin yana ajiyewa kai tsaye akan tagulla na allunan da'ira a matsayin shingen gujewa iskar oxygen. | 25µin (0.7µm) -60µin (1.5µm) | Mafi kyau don fasahar dacewa da jarida;Mai tsada;Tsara;Kyakkyawan solderability (lokacin sabo) da aminci;Lalata | Rushewar solderability tare da haɓakar yanayi & hawan keke;Tin da aka fallasa akan taron ƙarshe zai iya lalata;Magance matsalolin;Tin Wisking;Bai dace da PTH ba;Ya ƙunshi Thiourea, sanannen Carcinogen. | Shawarwari don manyan adadin samarwa;Yana da kyau don sanya SMD, BGA;Mafi kyau don dacewa da latsawa da jiragen baya;Ba a ba da shawarar ga PTH, masu canza lamba, da amfani tare da abin rufe fuska ba |
Table2 Ƙimar kaddarorin na yau da kullun na PCB Surface ya ƙare akan samarwa da aikace-aikace
| Samar da mafi yawan gama-gari da ake amfani da su | |||||||||
| Kayayyaki | ENIG | ENEPIG | Zinariya mai laushi | Zinariya mai wuya | IAg | ISn | HASL | HASL- LF | OSP |
| Shahararren | Babban | Ƙananan | Ƙananan | Ƙananan | Matsakaici | Ƙananan | Ƙananan | Babban | Matsakaici |
| Kudin Tsari | Babban (1.3x) | Babban (2.5x) | Mafi girma (3.5x) | Mafi girma (3.5x) | Matsakaici (1.1x) | Matsakaici (1.1x) | Ƙananan (1.0x) | Ƙananan (1.0x) | Mafi ƙasƙanci (0.8x) |
| Ajiye ajiya | Nitsewa | Nitsewa | Electrolytic | Electrolytic | Nitsewa | Nitsewa | Nitsewa | Nitsewa | Nitsewa |
| Rayuwar Rayuwa | Doguwa | Doguwa | Doguwa | Doguwa | Matsakaici | Matsakaici | Doguwa | Doguwa | Gajere |
| RoHS mai yarda | Ee | Ee | Ee | Ee | Ee | Ee | No | Ee | Ee |
| Tsarin Haɗin Surface don SMT | Madalla | Madalla | Madalla | Madalla | Madalla | Madalla | Talakawa | Yayi kyau | Madalla |
| Fitar da Copper | No | No | No | Ee | No | No | No | No | Ee |
| Gudanarwa | Na al'ada | Na al'ada | Na al'ada | Na al'ada | Mahimmanci | Mahimmanci | Na al'ada | Na al'ada | Mahimmanci |
| Ƙoƙarin Tsari | Matsakaici | Matsakaici | Babban | Babban | Matsakaici | Matsakaici | Matsakaici | Matsakaici | Ƙananan |
| Ƙarfin sake yin aiki | No | No | No | No | Ee | Ba a ba da shawara ba | Ee | Ee | Ee |
| Dakarun Zazzabi da ake buƙata | da yawa | da yawa | da yawa | da yawa | da yawa | 2-3 | da yawa | da yawa | 2 |
| Batun wuski | No | No | No | No | No | Ee | No | No | No |
| Thermal Shock (PCB MFG) | Ƙananan | Ƙananan | Ƙananan | Ƙananan | Ƙarƙashin Ƙasa | Ƙarƙashin Ƙasa | Babban | Babban | Ƙarƙashin Ƙasa |
| Low Resistance / High Speed | No | No | No | No | Ee | No | No | No | N/A |
| Aikace-aikace na gamawar saman da aka fi amfani da su | |||||||||
| Aikace-aikace | ENIG | ENEPIG | Zinariya mai laushi | Zinariya mai wuya | IAg | ISn | HASL | LF-HASL | OSP |
| M | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee |
| sassauƙa | An ƙuntata | An ƙuntata | Ee | Ee | Ee | Ee | Ee | Ee | Ee |
| Flex-Rigid | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ba a fi so ba |
| Fita mai kyau | Ee | Ee | Ee | Ee | Ee | Ee | Ba a fi so ba | Ba a fi so ba | Ee |
| BGA & μBGA | Ee | Ee | Ee | Ee | Ee | Ee | Ba a fi so ba | Ba a fi so ba | Ee |
| Yawan Solderability | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee | An ƙuntata |
| Juya Chip | Ee | Ee | Ee | Ee | Ee | Ee | No | No | Ee |
| Latsa Fit | An ƙuntata | An ƙuntata | An ƙuntata | An ƙuntata | Ee | Madalla | Ee | Ee | An ƙuntata |
| Ta hanyar-Rami | Ee | Ee | Ee | Ee | Ee | No | No | No | No |
| Waya Bonding | iya (Al) | Da (Al, Au) | Da (Al, Au) | iya (Al) | Mai canzawa (Al) | No | No | No | iya (Al) |
| Solder Wettability | Yayi kyau | Yayi kyau | Yayi kyau | Yayi kyau | Yayi kyau sosai | Yayi kyau | Talakawa | Talakawa | Yayi kyau |
| Solder hadin gwiwa Mutunci | Yayi kyau | Yayi kyau | Talakawa | Talakawa | Madalla | Yayi kyau | Yayi kyau | Yayi kyau | Yayi kyau |
Rayuwar shiryayye abu ne mai mahimmanci da kuke buƙatar la'akari yayin yin jadawalin masana'anta.Rayuwar Rayuwaita ce taga mai aiki wanda ke ba da ƙarewa don samun cikakkiyar walƙiya na PCB.Yana da mahimmanci don tabbatar da cewa duk PCB ɗinku sun taru a cikin rayuwar shiryayye.Baya ga kayan aiki da tsari wanda ke sa saman ya ƙare, rayuwar shiryayye na gamawa yana tasiri sosaita PCBs marufi da ajiya.Mai nema na madaidaiciyar hanyar ajiya da aka ba da shawarar ta hanyar jagororin IPC-1601 zai kiyaye walƙiya da amincin ƙarewa.
Table3 Shelf Rayuwa Kwatanta tsakanin Shahararrun Ƙarshen Ƙarshe na PCB
|
| Al'ada SHEL RAYUWA | Shawarwari Rayuwar Rayuwa | Sake Aiki Chance |
| HASL-LF | Watanni 12 | Watanni 12 | EE |
| OSP | Watanni 3 | Watanni 1 | EE |
| ENIG | Watanni 12 | Watanni 6 | A'A* |
| ENEPIG | Watanni 6 | Watanni 6 | A'A* |
| Electrolytic Ni/Au | Watanni 12 | Watanni 12 | NO |
| IAg | Watanni 6 | Watanni 3 | EE |
| ISn | Watanni 6 | Watanni 3 | YA** |
* Don ENIG da ENEPIG suna gama sake zagayowar sake kunnawa don haɓaka wettability na ƙasa da rayuwar shiryayye.
** Ba a ba da shawarar sake yin aikin sinadari ba.
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